BOP | MDDP | PCBA Store your memory anywhere
Advanced packaging technology for high-density memory applications
• High-density packaging
• Improved thermal performance
• Enhanced reliability
Multi-die packaging solutions for increased capacity and performance
• Multiple dies in single package
• Increased capacity
• Optimized performance
Complete PCB assembly services for memory modules and devices
• Full assembly services
• Quality testing
• Custom solutions
High-performance NAND flash memory chips
• Capacities: 1GB - 1TB
• SLC, MLC, TLC, QLC options
• High endurance
Dynamic Random Access Memory chips
• DDR3, DDR4, DDR5
• Various speeds available
• Low power consumption
Embedded MultiMediaCard memory solutions
• Capacities: 8GB - 512GB
• High-speed interface
• Compact form factor
Advanced packaging with improved thermal and electrical performance
Multiple memory dies in a single package for increased capacity
Complete PCB assembly and testing services
Tailored memory solutions for specific applications
Smartphones, tablets, and wearable devices
Laptops, desktops, and servers
Infotainment and navigation systems
IoT devices and embedded systems
Contact us for specialized memory chip requirements and bulk orders